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RK3576 System-on-module

SOM3576

     

    • Rockchip RK3576 SoC (4× Cortex-A72 + 4× Cortex-A53) with 6 TOPS NPU
    • Android 14 & Debian 12 support
    • LPDDR up to 16 GB, eMMC 32–256 GB
    • Dual Gigabit Ethernet, WiFi 6
    • Integrated PCIe/SATA/GMAC/SDIO 3.0/USB 3.0
    • 8K@30fps decoding, 4K@60fps encoding
    • Triple-display support (HDMI + LVDS + eDP)
    • MIPI‑CSI camera input and MIPI‑DSI graphic output
    • Standard MXM 3.0 interface, the size is only 82mm x 53mm

 

CPU Rockchip RK3576
Octa-core configuration with 4x Cortex-A72 and 4x Cortex-A53
GPU ARM Mali-G52 MC3 with support for OpenGL ES 1.1, 2.0, 3.2, OpenCL 2.0, and Vulkan 1.1
NPU 6 TOPS AI accelerator supporting INT4/INT8/INT16/BF16/TF32 mixed operations and framework switching of TensorFlow / MXNet / PyTorch / Caffe
Memory and Storage RAM: 4GB(8/16GB Optional)
Storage: 32GB(64/128/256GB Optional)
Multimedia Video Decoder: Supports H.264, H.265, VP9, AV1, and AVS2 up to 8K @ 30fps or 4K @ 60fps
Video Encoder: Supports H.264 and H.265 up to 4K @ 60fps, (M)JPEG encoder/decoder up to 4K @ 60fps
Connectivity Ethernet: 2x Gigabit Ethernet ports
Wi-Fi: Wi-Fi 6
Bluetooth: Bluetooth 5
USB: 1x USB 3.0, 1x Type-C
Other interfaces: PCIe, I2S, SDIO, SATA, SPI, I2C, DEBUG
Display Interfaces HDMI OUT*1( 7680×4320@60Hz)
HDMI IN*1(4096x2160p@60Hz)
eDP*1 up to 4K @ 60Hz
LVDS up to 4K @ 60Hz
MIPI DSI connector up to 2K @ 60Hz
Camera Interfaces 2x 2-lane MIPI CSI connectors
Operating Systems Supports multiple OS including Android14 / Debian12
Mechanical Characteristics Size: 82 x 53 mm
Board Structure: MXM3.0-314Pin standard core board
Operating temperature Commercial: 0~60°C
Industrial: -40~85°C
Development tools Carrier board, Board Support Package (BSP), and extensive documentation
POWER 5V/3A
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abe@fukanghk.com